发明名称 PROCESS FOR MOLDING A POLYSTYRENE FOAM STRUCTURE WITH A BONDED COVERING
摘要 <p>A process for molding in situ a polystyrene foam structure with a relatively rigid thermoplastic sheet covering a portion of the surface of the polystyrene foam. The thermoplastic sheet is cut and folded into proper shape and a heatactivated adhesive applied to the inside surface. The folded sheet is inserted into the female cavity of a mold which is then closed. Expandable polystyrene is injected into the interior of the folded sheet and heated to expand the polystyrene against the sheet and the adhesive is heat-activated to bond the sheet and polystyrene.</p>
申请公布号 CA1096119(A) 申请公布日期 1981.02.24
申请号 CA19770281339 申请日期 1977.06.24
申请人 MEAD CORPORATION (THE) 发明人 DICKENS, LUTHER I.
分类号 (IPC1-7):29D27/00 主分类号 (IPC1-7):29D27/00
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