| 摘要 |
PURPOSE:To prevent the leak occurrence and at the same time increase the sealing perfomance, by providing the single-layer film between the optical glass plate forming the transparent window of the solid state image pickup device and the sealing material to be adhered to the stem which fixes the semiconductor element. CONSTITUTION:Solid state image pickup element 3 is die-bonded to stage 2 of stem 1 made of ceramics and then connected to the external stem terminal through the wire bonding. Transparent window 4 is formed normally with the optical glass plate having a thickness of 0.5-1.0mm., and the surface of the window is polished optically in order to keep the high-grade optical characteristics. Thin film 5 of the silicon oxide is coated to the sealed surface side of the glass through the vacuum evaporation, the sputtering, the gaseous phase growth or other methods. Then epoxy-group adhesive 6 is applied on the coating surface via the silk screen printing process or the like to be semi-hardened. This glass plate with adhesive and the stem to which the semiconductor element is bonded are fixed together via the jig and tool and then hardened at the prescribed temperature and with application of the pressure necessary for sealing. In such way, no leak is caused even at a temperature and humidity of 85 deg.C and 85% each, thus increasing the sealing performance. |
