| 摘要 |
PURPOSE:To simplify the laying on and taking off of element of a flat package type semiconductor stack by a method wherein a hole for bolt is provided at the center part of the lower pedestal of the stack and a bolt is screwed into the tapped hole of a spring bearing to control the pressing force against the elements. CONSTITUTION:The flat package type semiconductor stack consists of stacked semiconductor elements and cooling fins attached by pressing with supporting bolts 10. The hole 12a for the bolt is provided at the center of the lower pedestal 12, and the tapped hole 13a for the bolt is provided at the center of lower end part of the spring bearing 13 provided with spring washers 5. When the elements are made to be taken off and laid on, an attracting bolt 14 is screwed in to control the pressing force of the spring washers 5 against the elements. By this way, the elements can be made easily to be taken off and laid on without necessitating a special bolt, a special wrench, etc. |
