发明名称 METHOD OF AND MACHINE FOR SEVERING COMPOUND PLATES
摘要 <p>Elongated compound plates are severed at desired intervals in a bandsawing machine wherein the frame for a travelling saw band is movable in and counter to the direction of movement of the plates as well as in and counter to a second direction at right angles to the first direction. The frame further supports a tool which is located behind the band, as considered in the second direction, and is provided with two deburring surfaces serving to penetrate into the kerf which is formed while the frame moves simultaneously in the first and second directions. The freshly severed portions of plates are accelerated in the first direction to increase the width of kerfs so that the band can be readily retracted counter to the second direction prior to returning to a starting position by moving with the frame counter to the first direction. The widening of the kerf can be effected by the tool or by a conveyor which receives successively separated portions of moving plates and accelerates them in the first direction. The plates are free to catch up with and to push the freshly separated portions in the first direction as soon as the band is retracted counter to the second direction.</p>
申请公布号 CA975258(A) 申请公布日期 1975.09.30
申请号 CA19720144889 申请日期 1972.06.16
申请人 HOESCH AKTIENGESELLSCHAFT 发明人 JUDITZKI, FRANZ
分类号 B23D53/04;B23D55/02;B23D55/04;B26D1/00;B26D1/04 主分类号 B23D53/04
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