| 摘要 |
A resin mold type semiconductor device comprising molded articles for sealing, each consisting of a resin material and having a gap portion thereinside; a semiconductor element positioned in said gap portion inside said molded article for sealing, said seminconductor element having electrodes; electrically conductive leads, each positioned in said gap portion of said molded article for sealing and having one end thereof protruding outwardly from said molded article for sealing; wires, each electrically connecting said electrode of said seminconductor element to said lead; and an insulation material covering at least the surface of said semiconductor element. |
