| 摘要 |
A device for removing a solder alloy from a solid soldered joint comprising a multiplicity of metallic strands formed into an elongated wick operable to effect the solder removal through the application of an end portion thereof to the joint in heat exchange relation to a heat source so that when the solder alloy is rendered molten by the heat source it will flow by capillary action from the joint into the applied end portion of the wick, the device being improved in that each metallic strand 12 of the wick has its exterior surface coated with solidified solder alloy 14 having a melting point substantially below the melting point of tin prior to being formed into the wick so that when the end portion thereof is applied to the joint in heat exchange relation with the heat source as aforesaid the solid solder alloy of the coating on the strands of the applied end portion when rendered molten by the heat source mixes with the molten solder alloy from the joint flowing by capillary action into the applied end portion of the wick. |
