| 摘要 |
PURPOSE:To obtain a transfer foil easily solderable and excellent in electrical conductivity even using a conductive paste by a method wherein the transfer foil is composed of such a structure that a basic film, a high separative layer, a copper thin film layer etched after a required circuit pattern, a conductive paste printing layer, and a transfer adhesive agent layer are laminated in this sequence. CONSTITUTION:A printed circuit transfer foil is provided, which is composed of such a structure that a basic film 1, a highly separable layer 1a, a copper thin film layer 2 etched after a prescribed circuit pattern, a conductive paste printing layer 3, and a transfer adhesive agent layer 4 are laminated in this sequence. And, the copper thin film is provided to the high separative layer 1a of the basic film 1, and the conductive paste printing layer 3 provided with a prescribed circuit pattern is deposited onto the copper thin film layer 2. Next, an etching treatment is performed so as to remove the disused part of the copper thin film layer 2 other than the circuit pattern, and the transfer adhesive agent layer 4 is provided onto the face of the laminated body, after finishing the above process, on the conductive paste printing layer 3 side for the formation of a printed circuit transfer foil. |
