| 摘要 |
PURPOSE:To enhance heat cycle property of a metal-plated molded product of a resin mixture obtained by adding an organosilicon compound to a polycarbonate resin or a mixture of a polycarbonate resin and an ABS resin. CONSTITUTION:0.05-3pts.wt. of an organosilicon compound such as polysiloxanes or halosilanes is mixed with 100pts.wt. of a mixture comprising 100-5wt% of an aromatic polycarbonate resin such as 4,4'-dihydroxydiphenylalkane (component A) and 0-95% of an ABS resin comprising a graft copolymer obtained by grafting an aromatic vinyl monomer such as styrene, a vinyl cyanide monomer such as (meth)acrylonitrile, and a methacrylic acid ester monomer to a diene type rubber alone or as a mixture of said graft copolymer and a copolymer of each above-described monomer (component B). When a molded product from this composition is thinly plated by a metal, it is plated by Ni or the like without plating copper as an undercoating and shows excellent heat cycle property. This plated layer neither peels nor blistering. |
