发明名称 METAL CAP FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the unevenness or failure in plating due to the overlap of metal caps in the plating process by coupling the metal-cap portions through a coupling portion provided to each of them. CONSTITUTION:Each square metal-cap portion 11 to be seam-welded is joined at constant intervals to a neighboring metal-cap portion by means of the coupling portion 11a through its four corners so that the metal-cap portions are not separated when a thin metal plate is punched. Moreover, the metal-cap portion 11 is provided with a feed portion 11c so that a continuous feed is possible. This permits the cap portions 11 to be hoopedly wound, plating to be continuously performed, and the metal caps to be plated without overlap.
申请公布号 JPS5613752(A) 申请公布日期 1981.02.10
申请号 JP19790090201 申请日期 1979.07.16
申请人 NIPPON ELECTRIC CO 发明人 KUBOTA SHIGERU
分类号 H01L23/02;B23K11/00;H01L21/48 主分类号 H01L23/02
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