| 摘要 |
<p>A process for highspeed branding of an intricate pattern, usually a wood grain pattern, into various materials is disclosed. The material to be branded is passed under a heated rotary die having the desired pattern thereon to emboss, by heat shrinking, and to char the pattern into the material; and the improvement of the process of the present invention, which effects an increased die life, is comprised of maintaining the die at about a temperature between about 800.degree.F. and about 900.degree.F. The die pattern is preferably relatively deep, in excess of 0.040 inch, and is urged into the material to a depth less than the full pattern depth and preferably to about one-half the pattern depth. Products which have heretofore never been branded or embossed, such as plaster-board, particle board and hard board, are also disclosed.</p> |
