发明名称 METHOD OF BONDING HIGH VOLTAGE ALUMINUM BALL
摘要 <p>To permit ball-bonding of wires of aluminium or aluminium alloy to small electrical circuits or components, a spark discharge is created between the end of the wire and an electrode in a shielding atmosphere with a peak current density in the wire section which is from 40 to 450 times that used for ball-bonding gold wire. In this way oxidation of the ball is prevented.</p>
申请公布号 JPS5440570(A) 申请公布日期 1979.03.30
申请号 JP19780090572 申请日期 1978.07.26
申请人 发明人
分类号 B23K9/00;B23K20/00;B23K20/14;H01L21/60;H01L21/607 主分类号 B23K9/00
代理机构 代理人
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