| 摘要 |
PURPOSE:To provide a high-density head which is easy to manufacture and has high reliability by a method wherein a group of conductors is divided into blocks for connecting a heating resistor of the thermal head with an outside scanning circuit, and a unidirectional semiconductor element is fitted to each of the blocks. CONSTITUTION:A thin copper plate is adhered onto a heat-resistant insulating film 12, and photoetching is conducted to form conductor wires 13, 14, 15, and the film 12 is provided with opening portions 16-18 so as to expose fingers 13a, 13b, 14a, 14b, 15a, 15b at the tip end portions of the conductor wires. Further, a diode array chip 19 is inserted into the opening portion 17 and connected with the fingers 13b, 14a to constitute a film lead unit. After cutting the unit along a line C-C' and a line D-D', the cut pieces are fitted onto a substrate 24 comprising a heating resistor array, parallel conductor 22 and a conductor 23, the conductor 15 is connected with a common terminal for the heating resistors and with the conductor 23, the conductor 13 is connected with the terminals of the heating resistors, and the conductor 14 is connected with the parallel conductor 22. |
