发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable to perform a satisfactory soldering on a strip-line package type transistor with a shortest lead length by a method wherein a mesh is used as an external lead. CONSTITUTION:A strip-line package type transistor 11 to be applied to a strip-line is consisted of a transistor chip sealed and fixed with a resin 3 on a stud 12. All of emitter leads 14e arranged in parallel with each other at the opposite side face of the cylindrical sealing resin 13, and a collector lead 14c and a bass lead 14b led out from the center part to the opposite direction with each other are consisted of a nearly 5mm. width mesh belt woven with a 0.13phi gold-plated copper wire.
申请公布号 JPS5612761(A) 申请公布日期 1981.02.07
申请号 JP19790087034 申请日期 1979.07.10
申请人 NIPPON ELECTRIC CO 发明人 HIKINO TETSUYA
分类号 H01L23/50;H01L23/49 主分类号 H01L23/50
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