| 摘要 |
<p>PURPOSE:To facilitate the stamping of plural marks on the limited face area of a semiconductor device by a method wherein a part of indicating marks are displayed by changing the roughness of surface. CONSTITUTION:The whole face of a semiconductor device is made to be glossy, lettering parts 2 only are made to be frosting state like a pear surface and the surface of semiconductor device is embossed with indicating marks e.g. letters according to the presence of frosting simultaneously with the enclosement of resin. As mentioned above, letters are formed on the surface of semiconductor device to substitute for a part of stamping, and other necessary letters and numbers are stamped by the ordinary stamping operation.</p> |
