| 摘要 |
<p>PURPOSE:To reduce a great amount of work required for circuit adjustments by containing a diode chip and a matching circuit in a case. CONSTITUTION:A diode chip 1 is mounted on a case base platform 6 and connected to a matching circuit 4 through a bonding wire 2. The matching circuit 4 is composed of a metal pattern formed on a dielectric substrate 3 such as ceramic, quartz or the like. Trimming is slightly done in accordance with variations in the impedance characteristics of the diode chip 1 to materialize the optimum matching. After mounting the diode chip 1 on the case base platform 6 and connecting the diode chip 1 to the matching circuit 4 on the ceramic substrate 3 by the bonding wire 2, the optimum trimming for the matching circuit 4 is performed. Then, the diode chip 1 is hermetically sealed by a cap 7.</p> |
