| 摘要 |
<p>A heat-hardenable resin compsn. contains (a) is not 1 bis-maleinimide and/or polymaleinimide, and (b) is not 1 alkenyl-phenol deriv., alkenylaniline deriv., and/or linear dimers and polymers. A claimed cpd. (a) is N,N'-(methylenedi-p-phenylene) -bis-maleinimide (I), and claimed cpds. (b) are p-iso-propenylphenol, p-isopropenylaniline and N-(p-isopropenylphenyl)-maleinimide and their linear dimers. The ratio by wt. of (a):(b) is 1-300:1 (5:2-200:1). The compsn. may also contain a polymerisable unsatd. cpd., more esp. (substd.) styrene, acrylonitrile, (meth)acrylic acid or esters, acrylamide, glycidyl (meth)acrylate, unsatd. polyesters, cyclised polybutadiene or polybutadiene with a 1,2-double bond. The compsns. are used for laminates, moulding materials, lacquers for electrical insulators, high-temp. adhesives, and as inhibitors against decomposition of rubber by heat, as hardeners, and as powder coatings. The compsn. is storage-stable, resists heat and moisture, and has good electrical and mechanical properties.</p> |
