| 摘要 |
<p>PURPOSE:To reduce the number of connecting portions in a composite semiconductor device, eliminate heat generation therein and simplify the assembling of the device by integrating main electrode in a container of an SCR or a rectifier element with a main electrode for externally connecting the device. CONSTITUTION:An alumina plate 2 is soldered to a base 1, and integrated main electrode terminals 5a, 5b and electrode plates 3a, 3b are soldered on the alumina plate 2. Then, SCR 4a, 4b are fixed onto the electrode plates 3a, 3b respectively with low melting point solder. The end of the electrode plate 3b is soldered to the cathode of the SCR 4a. The main electrode terminal 5c is integrated with the electrode plate 6b and is soldered to the cathode of the SCR 4b. This configuration is surrounded by the wall 8 of a resin container, resin 10 is filled therein, and is sealed with a resin cover 9. This construction can remove a heat source in the vicinity of the SCR by the integration of the electrodes so as to improve the reliability of the device. Further, it decreases the number of component parts so as to simplify the assembling of the device.</p> |
