| 摘要 |
An angle soleplate for use as part of a heating type crack sealing system for applying thermosetting tape in an interior angle or corner joint formed by adjoining walls of a building, or for drying drywall tape already applied there, includes a thermally conductive sleeve with a "V" bottom therealong joining a rectangular inverted-"U"-section mounting portion; the contour of the "V" bottom preferably has a slight rounding at the apex of the "V" for reducing working pressure on the tape at a corner, and the invention preferably provides for detachable attachment to permit greater versatility in use of the crack sealing system.
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