Universal copper-plating solution

摘要

A copper-plating bath suitable for reprographic uses and for making electrically conducting metal patterns with one of the redox pairs V2+/V3+, Ti2+/Ti3+, or Cr2+/Cr3+ as a reducing agent, ascorbic acid with an acid acceptor, or the redox pair Fe2+/Fe3+ together with an organic carboxylic acid and a complexing agent for cuprous ions.