| 摘要 |
PURPOSE:To prevent a short-circuit of a tab by means of a convex projection provided on the bonding wire connected surface of a lead piece adjacent thereto. CONSTITUTION:A convex projection 121a is formed on the main surface 121 of a lead piece 12 adjacent to a tab 11. A bonding wire 14 for connecting a semiconductor pellet 13 on the tab 11 to the tab side of the lead piece 12 is bonded across the convex projection 121a. This eliminates any slacking of the bonding wire preventing short-circuiting of the tab. |
