发明名称 TIN ELECTRO-PLATING SOLUTION
摘要 Tin electro-plating solution contains sulfamic acid ion 30-300 g/l, divalent tin ion 15-300 g/l and aromatic nucleus OH group or the salt 5-100 g/l. Thus, the plating solution which contains divalent tin ion 70.2 g/l, sulfamic acid ion 2 10 g/l, polyethyleneglycol nonylphenylether 20 g/l and O-cresol sulfonic acid 40 g/l is coated on the copper plate at the temp. 30≦̸C with 25 A/dm2 current density for 50 seconds.
申请公布号 KR810000022(B1) 申请公布日期 1981.02.02
申请号 KR19760001565 申请日期 1976.06.24
申请人 SUMITOMO DENKI KOGYO CO LTD 发明人 MURAKAMI KAZUHITO
分类号 C25D3/32;(IPC1-7):C25D3/32 主分类号 C25D3/32
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