ETCHING METHOD OF ETCHING ANISOTROPIC WAFER,申请号JP19800091058-传众专利搜索

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发明名称	ETCHING METHOD OF ETCHING ANISOTROPIC WAFER
摘要
申请公布号	JPS5716170(A)	申请公布日期	1982.01.27
申请号	JP19800091058	申请日期	1980.07.03
申请人	SUWA SEIKOSHA KK;MATSUSHIMA KOGYO KK	发明人	ENDOU KATSUMA;KARAKI EIJI
分类号	C23F1/00	主分类号	C23F1/00
代理机构		代理人
主权项
地址

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