发明名称 ELECTROPLATING OF CHROMIUM
摘要 A process for plating thick chromium coatings for engineering applications comprises depositing a thin initial layer from a low concentration chromium III/thiocyanate bath and depositing the bulk of the remaining thickness from a relatively higher concentration chromium III/thiocyanate bath. Deposits produced by this two-stage process are more cohesive and smoother than those obtainable by plating the entire thickness from the high concentration bath alone.
申请公布号 JPS569385(A) 申请公布日期 1981.01.30
申请号 JP19800060779 申请日期 1980.05.09
申请人 IBM 发明人 JIEEMUZU MAIKERU RINFUOODO BUI
分类号 C25D3/06 主分类号 C25D3/06
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