| 摘要 |
An integrated circuit (IC) chip package comprises a plurality of IC chips mounted on a multilayer substrate. A plurality of covers are provided on the substrate and are positioned so as to cover at least one of the IC chips. External pins are provided on each of the covers, and each of the pins is connected to selected chips via first signal lines on the covers connecting the pins to the substrate, and second signal lines within the substrate connecting the first signal lines to the selected chips. The substrate may be provided with a heat exchanger or heat sinks at the underside thereof, the overall construction resulting in a cool operating IC chip package with numerous external terminals having short wiring lengths to the chips.
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