| 摘要 |
PURPOSE:To increase a packing effect and to improve a dampproof property by having a constitution in which at least a silver film is sealed in resin. CONSTITUTION:Around the element section of a lead 1, on which a semiconductor element 3 is connected, a silver-plated film 2 is partially formed, and this film 2 is sealed with resin 5 so that the film is not exposed to the outside. By providing the silver-plated film 2 on the surrounding section of the element as avove, the dampproof porerty can be improved thoroughly because the moisture infiltrates from the outside. Also, when a shearing stress is generated on the interface of the resin 5 and the lead 1 due to the disagreement of the thermal expansion coefficients of the resin 5 and the lead 1, the contracting resin 5 is pressed on the side of the film 2 by its contractive force, thereby stopping the contraction of the resin 5. Besides, the shearing stress is absorbed by the film 2 and the packing effect is increased because of the improvement in the degree of adhesion or fit between the resin 5 and the film 2. |
