| 摘要 |
1. Connection frame (2) carrier plate for the housing of electronic components such as integrated circuits, formed of a conducting plate (1) having a location (12) on a first face (11) for receiving an integrated circuit chip, comprising a boss (13) in the neighborhood of the location and provided with a groove (131), characterized in that this groove has a plane bottom which is parallel to said first face of the conducting plate and is located at a determined level (z) with respect to said first face, the bottom having a transverse dimension exceeding the width of a strip (21) of the connection grid (2) to be applied thereagainst and affixed thereto after having precisely positioned said grid with respect to said location (12). |
