| 摘要 |
The invention relates to a method and apparatus of vapour phase soldering comprising a treatment chamber (3) in which the vapour of a high boiling point working fluid heats the objects (1) to be heated while they are conveyed by conveyor means (C1 - C5) along a path through a pre-heat chamber (2), a treatment chamber (3) and a drying chamber (4). The vapour generator (5) discharges the vapour above the conveyor and falls by gravity through the conveyor, heating the objects on its way. Vapour below the conveyor is collected in a chamber (6) and condensed by cooling coils (7). Air curtains in the chambers (2 and 4) inhibit escape of expensive working fluid, the vapour entrapped in the air flows being cooled by the cooling pipes (7 min , 7 sec ) in the chambers (16, 17) and subsequently in the separators (30) during recirculation to the fans (14, 15).
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