发明名称 |
Ceramic plate for supporting a semiconductor wafer |
摘要 |
A semiconductor wafer is supported by a supporting plate via adhesive in some steps of fabricating a semiconductor device. The supporting plate is a porous ceramic plate impregnated with or painted with resin such as epoxy resin, silicone resin and polyimide varnish. The porous ceramic supporting plate has a low thermal conductivity to ensure stable bonding operation.
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申请公布号 |
US4247590(A) |
申请公布日期 |
1981.01.27 |
申请号 |
US19770858636 |
申请日期 |
1977.12.08 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
HAYAKAWA, MASAO;MAEDA, TAKAMICHI;HORII, TERUO;KUMURA, MASAO;CHIKAWA, YASUNORI |
分类号 |
H01L21/683;H01L21/60;H05K1/03;(IPC1-7):B32B3/00;B32B3/26 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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