| 发明名称 |
METAL BONDED DIAMOND AGGREGATE ABRASIVE |
| 摘要 |
<p>60SD-164 IMPROVED METAL BONDED DIAMOND AGGREGATE ABRASIVE An improved diamond aggregate abrasive is disclosed comprising milled saw diamond having an average size less than 75 microns held in a silver/ copper alloy matrix which also contains a wetting agent fro (e.g. titanium). Tests of grinding wheels containing this new aggregate have shown a marked improvement in grinding ratio over commercially available diamond aggregates.</p> |
| 申请公布号 |
CA1179849(A) |
申请公布日期 |
1984.12.25 |
| 申请号 |
CA19820408518 |
申请日期 |
1982.07.30 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
HAYDEN, STEPHEN C. |
| 分类号 |
B24D3/00;B24D3/06;B24D3/34;C09K3/14;C22C26/00;(IPC1-7):C09K3/14 |
主分类号 |
B24D3/00 |
| 代理机构 |
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代理人 |
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| 地址 |
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