Bonding thermoplastic or thermosetting resins

摘要

Methods of bonding between thermoplastic or thermosetting resins and inorganic oxide substrates are improved by providing to the resin/inorganic oxide interface as an adhesion promoter a combination of (a) a copolymer of an ethylenically unsaturated organic monomer and an unsaturated organosilane containing hydrolyzable groups; and (b) a monomeric hydrolytically reactive organosilane.