Direct metallisation, esp. of microcircuits, by electroplating - with low current pre-metallising and high current metallising in single bath

摘要

A conductive substrate is metallised by carrying out the following steps using the same electroplating bath: (a) depositing, slowly and at low current, a thin pre-metallisation layer having a fine crystalline structure, and (b) depositing, rapidly and at high current, a metallisation layer having the same structure. The method is useful in silver, gold and nickel plating, esp. in the prodn. of electronic microcircuits to connect conductors and semiconductors and metallise support grids. The metallisation layer can be deposited rapidly and, since it has the same fine structure as the pre-metallisation layer, is adherent and resistant to aging.