| 摘要 |
PURPOSE:To reduce external force applied through an external lead extremely by unevenly distributing the position of the center of a chip mounting bed on one side of a central straight line extended from the center line of the axis of a lead projected from the bed and forming a projecting section projecting to the other side of the central straight line to the bed. CONSTITUTION:The position of the center 11 of a chip mounting bed 2 is distributed unevenly on one side of the central straight line 7 of the axis of a lead 3a projected from the bed 2, and the chip mounting bed 2 has a projecting section 6 projected to the other side of the central straight line 7. The nose section of an external lead in a device (to which the external lead is not molded) after assembling and a resin seal is soldered and fixed at the predetermined positions of a test substrate, etc., and the external lead is molded and machined. As results of the investigation of the characteristics of the device and the examination of the presence of a characteristic change and the breakdown of a chip before and after the molding and machining of the external lead, no defective was generated. Accordingly, it has been confirmed that projecting sections share the considerable parts of tensile force applied to the external lead and fill the role of the stopping of tensile stress. |
