发明名称 METHOD FOR POLISHING DIE
摘要 PURPOSE:To perform highly accurate and effective and better polishing on a face to be machined by applying magnetic vibration and supersonic vibration to at least one of a die to be machined and a symmetrical die for polishing while supplying abrasive between the face to be machined of the die and the polishing face of the symmetrical die. CONSTITUTION:A face to be machined 1a of a die to be machined 1 and the polishing face 2a of a symmetrical die 2 corresponding to the face to be machined 1a are arranged in opposite positions to each other, and abrasive 4 containing abrasive grain 5 is supplied in a clearance between these opposite faces 1a and 2a by blowing with a nozzle 3. At the same time, both of the die to be machined 1 and the symmetrical die 2 are, or either of them according to the necessity is vibrated to the arrow mark direction by magnetic vibration, supersonic vibration etc., and the face to be machined 1a is profiled by the polishing face 2a in the vibrating direction and applied with polishing by synergetic effect of the blowing operation of the abrasive 4 and the vibrating operation.
申请公布号 JPS6215073(A) 申请公布日期 1987.01.23
申请号 JP19850151768 申请日期 1985.07.10
申请人 MITSUBISHI ELECTRIC CORP 发明人 INAGAKI YOSHIHIKO;SHIBATA YOSHIO
分类号 B24B37/00 主分类号 B24B37/00
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