发明名称 SEMICONDUCTIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain the titled composition having excellent heat-resistance and suitable for forming an outer semiconductor layer of a cable, by adding a specific amount of electrically conductive carbon black to a base polymer consisting of a tetrafluoroethylene-propylene copolymer and a polyolefin resin. CONSTITUTION:(A) 100pts.(wt.) of a base polymer consisting of (a) 10-80pts. of a tetrafluoroethylene-propylene copolymer and (b) 90-20pts. of a polyolefin resin having a melting point of <=180 deg.C or its copolymer (e.g. polyethylene, ethylene-vinyl acetate copolymer, etc.) is compounded with (B) 10-100pts. of electrically conductive carbon black (e.g. acetylene black). The outer semiconductive layer produced from said composition has moderate releasability from the insulation layer of a cable, and the terminal treating work in the connection of cables can be facilitated.
申请公布号 JPS6215244(A) 申请公布日期 1987.01.23
申请号 JP19850155479 申请日期 1985.07.15
申请人 FUJIKURA LTD 发明人 NIWA TOSHIO;MAEDA TAKASHI
分类号 C08L23/00;C08K3/00;C08K3/04;C08K5/34;C08L23/14;C08L27/00;C08L27/12;C08L27/18;H01B1/24 主分类号 C08L23/00
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