发明名称 EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL
摘要 <p>PURPOSE:A composition, obtained by incorporating a specific epoxy resin with a curing agent and curing catalyst, capable of increasing the curing rate and having improved fluidity characteristics, heat, water and chemical resistance, etc. CONSTITUTION:A composition obtained by incorporating an epoxy resin having <=0.01wt% hydrolyzable chlorine content and <=0.01wt% alpha-diol content with a curing and curing catalyst. Dicyandiamide is used as the curing agent and 2-ethyl-4-methylimidazole is used as the curing catalyst. The above-mentioned epoxy resin is obtained by reacting bisphenol A with epichlorohydrin by the two-stage method.</p>
申请公布号 JPS6230145(A) 申请公布日期 1987.02.09
申请号 JP19850170362 申请日期 1985.08.01
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KAMIYAMA TAKAHISA;HIBINO AKINORI
分类号 C08G59/00;C08G59/02;C08G59/20;C08L63/00;H01L23/29;H01L23/31;H05K1/03 主分类号 C08G59/00
代理机构 代理人
主权项
地址