| 摘要 |
PURPOSE: To simplify a structure to improve productivity, and further durability and reliability by forming a circuit substrate, provided separately from plastic package mounting semiconductor device, folded by 180 deg. so as to expose electrodes. CONSTITUTION: A semiconductor module 14 is formed by mounting a semiconductor device 16 within a plastic package 15 and by equipping electrodes 18 on a flexible circuit substrate 17 provided along this package 15. As a result, structure of the semiconductor module 14 can not only be made simpler than before but also dispose the electrodes 18 at a position not overlapping depth-wise with the semiconductor device 16 by making use of the flexible circuit substrate 17. Accordingly, production of the semiconductor module 14 becomes easier to raise its productivity, pushing force exerting on the electrodes 18 does not reach the semiconductor device 16 to make mechanical destruction hardly happen, so that durability and reliability of thin semiconductor card 11 can be improved. |
