| 摘要 |
PURPOSE:To increase the yield of products and cutting down the cost thereof while enabling the elements to be connected in a short time by a method wherein the ends of inner leads are bent into an almost Z-shape to bond the ends thereof to elements formed on the backside of semiconductor elements using bonding agents. CONSTITUTION:After mounting an IC chip 2 on a die pad lead 1, inner leads 6 are bent along the chip 2. Bonding agents 7 stuck to the ends of inner leads 6 are melted by inner lead electric bonders 8 to bond the inner leads 6 to the IC chip 2 for electrically connecting them to each other. Through these procedures, the inner leads 6 and the IC chip 2 can be connected in a short time cutting down the cost of products without using any expensive fine wire such as gold (Au) etc. Furthermore, any discrepancy due to resin etc. during the sealing process can be eliminated increasing the yield of products. |
