发明名称 METHOD OF BONDING PELLET
摘要 PURPOSE:To improve a bonding property and a resin seal-up heat resisting property, by bonding a wire while blowing clean gas onto a pellet in a baking process to forcedly exhaust gas produced from silver paste. CONSTITUTION:When silver paste is heated, various kinds of gas are produced and are likely to contaminate an Al pad and greatly reduce wire bonding strength. If the gas adheres to the surface of a pellet and stays on the boundary between the surface and resin, humidity resistance deteriorates. To eliminate such disadvantages, nozzles 11 for ejecting clean air are provided in a heating furnace 9. The clean gas is blown onto the top of a lead frame 1 passing. Undesirable gas is sucked through numerous suction holes 14 under and alongside a chute 8 and exhausted through 13. Bonding is effected in such environment. As a result, the reliability of bonding property and humidity resistance is enhanced.
申请公布号 JPS564242(A) 申请公布日期 1981.01.17
申请号 JP19790079199 申请日期 1979.06.25
申请人 HITACHI LTD 发明人 SHIMATA TSUTOMU;SUMIYA OSAMU;ITOU KAORU;TSUBOSAKI KUNIHIRO;SUZUKI AKIRA
分类号 H01L21/52;H01L21/58 主分类号 H01L21/52
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