| 摘要 |
A planar charge plate having individual charge electrodes uniformly spaced along one face thereof is provided by cutting grooves into the edge of a blank nonconductive charge plate support structure. The surfaces of the structure, including grooves and lands, are metallized and printed circuit leads are formed leading from the grooves. The grooves are filled with an electrically conductive material such as solder, and then the front face of the structure is lapped to remove excess solder and metal plating from the lands to form the completed planar-faced structure. |
