| 摘要 |
<p>A method for manufacturing X-ray lithography masks containing features smaller than 1 micron in size and having conductive or non-conductive substrates. The method involves the initial deposition, as by evaporation, of a very thin coating of a strong X-ray absorber such as gold. A layer of photoresist is applied to the initial gold layer and exposed and developed to remove the photoresist in the exposed areas. Thereafter, the mask is submerged in an electroless gold plating bath. I have discovered that metals suitable for electroless plating are autocatalytic in nature. Accordingly, additional gold from the bath is preferentially deposited on the exposed first gold layer and is permitted to build to the desired thickness.</p> |
