发明名称 ELECTROLESS PLATING METHOD
摘要 PURPOSE:To bring the inner peripheral surface of a cylindrical ceramic material into excellent contact with a plating fluid, by, in electroless plating of the ceramic material for electronic parts having a cylindrical inner peripheral surface which opens at the ends, dipping the ceramic material into the electroless plating fluid maintained at an evacuated state so as to degas quickly the inner space of the cylinder. CONSTITUTION:A ceramicmaterial 1 made of, for example, BaTiO3 derivative ceramic, having cylindrical inner peripheral surface which opens at both ends is degassed by the following way just before it is dipped into an electroless plating fluid 8 contained in a vessel 7, preferably as shown by an arrow 12, then it is dipped into the plating fluid 8. That is, the vessel 7 is closed tightly by a cover 9, and the closed space is connected through an evacuating path 10 to a vacuum pump 11, hereby it is kept under reduced pressure. This method permits to form quickly deposit on the cylindrical inner peripheral surface as well, and the gas generated by the plating reaction is released rapidly, so that the plating fluid circulates smoothly and the plating reaction time is reduced.
申请公布号 JPS563664(A) 申请公布日期 1981.01.14
申请号 JP19790077906 申请日期 1979.06.19
申请人 MURATA MANUFACTURING CO 发明人 NISHIMURA KUNITAROU
分类号 C23C18/16;C23C18/18;C23C18/31;C23C18/34;C23C18/40;H01G4/012 主分类号 C23C18/16
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