| 摘要 |
An apparatus and method for consecutively transferring wafers used in the fabrication of semiconductor devices between carriers having either the same spacing distance or different spacing distances are disclosed. A plate is positioned below an inverted first carrier and above a second carrier. The position of the plate and the second carrier is changed so that wafers fall consecutively from notches in the first carrier into every nth notch in the second carrier, where n is a positive integer.
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