| 摘要 |
PURPOSE:To mold leads into a required shape without generating cracking and deficit of a mold part, or a break of the leads, further breaking of a wire inside the mold part by molding, while the base ends of the leads and their neighboring parts are held between or being guided allover the molding process. CONSTITUTION:The base ends A on the side parts of a mole part M of the leads L let out from the sides of the mold part M, which is a resin-molded semiconductor chip, are held between from up and down, the middle parts B of the leads are turned upward and the neighboring parts C near the outer sides of the base ends A are curved preliminarily downward respectively. Next, while being guided so as not to generate deformation of the neighboring parts C, the middle parts B are curved up to the required final angle theta. Next, while being guided so as to maintain the curved angle of the middle parts B of the leads L, the base ends A are curved in the direction approaching the sides of the mold part M until the spaces supporting the lower parts of the base ends A are exhausted. Finally, the base ends A are curved up to the final angle thetain the direction wherein the middle parts B approach the sides of the mold part M. |
