A method is described for producing a doped insulator layer which is located between two electrically conducting layers arranged on top of one another in an integrated semiconductor circuit. A layer of undoped oxide is formed on the lower of the two layers to be insulated, and a layer of a doped oxide is then formed on this layer by means of a centrifugal deposition process. Subsequent to this, the two oxide layers are densified by a high-temperature treatment.
申请公布号
DE3833931(A1)
申请公布日期
1990.04.12
申请号
DE19883833931
申请日期
1988.10.05
申请人
TEXAS INSTRUMENTS DEUTSCHLAND GMBH, 8050 FREISING, DE