| 摘要 |
Modular processing equipment of semiconductor wafers consists of a chassis (102), connected to an underlying service facility sub- assembly (104). The chassis can move independently on castors (110). Within the chassis are a pair of lever assemblies (112) and a horizontal docking plate (114). The lever assemblies are interconnected by a lever rod (156) for simultaneous operation, raising and lowering the docking plate to provide interconnection with service facilities extending from the sub-assembly, and subassembly docking plate (158) and cahssis docking plate have aligned openings for connection of services.
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