| 摘要 |
<p>PURPOSE:To easily mount an electronic circuit in high reliability by removing a resist used for a mask at the time of forming a hole together with an adhesive layer on an electrode of an electronic part. CONSTITUTION:A polyimide resin film 12 having an adhesive layer 13 is secured to a frame 11 made of Ni or the like. A resist mask 14 is formed thereon to etch the resin film 12 with NaOH so as to form tapered holes 15 having a gradient of approx. 45 deg.. Then, the electrode 16' of an LSI 16 is conformed to the hole 15 of the electrode 17' of a chip resistor 17, and the LSI and the resistor are heated to be secured to a resin film adhesive layer 13. The adhesive layer 13 on the electrodes 16' and 17' is plasma etched to form a wire 18 of aluminum or the like 18. Accroding to this configuration, the steps can be simplified, the resin film 12 is protected with the resist mask 14 not to be reduced in thickness with the dry etching so as to improve high reliability. Since no resist isolating solution or the like is employed, the work becomes safe.</p> |
