发明名称 METHOD OF PROVIDING SPACERS ON A SUBSTRATE
摘要 In a method of providing spacers on an insulating substrate, by which spacers the thickness of a connection between an electrical component and a substrate is adjusted, the spacers are rigidly provided on the substrate as a thick film pattern simultaneously with and with the same material as is used for at least one further thick film coating required for an electrical circuit on the substrate.
申请公布号 AU513792(B2) 申请公布日期 1981.01.08
申请号 AU19780035568 申请日期 1978.04.28
申请人 PHILIPS GLOEILAPENFABRIEKEN N.V. 发明人 W.C. HILDERING
分类号 H05K3/34;H01L21/48;H01L21/60;H05K1/09;H05K1/18;H05K3/30;(IPC1-7):01L21/58;01L23/48;01L23/12;01L49/02 主分类号 H05K3/34
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