发明名称 |
METHOD OF PROVIDING SPACERS ON A SUBSTRATE |
摘要 |
In a method of providing spacers on an insulating substrate, by which spacers the thickness of a connection between an electrical component and a substrate is adjusted, the spacers are rigidly provided on the substrate as a thick film pattern simultaneously with and with the same material as is used for at least one further thick film coating required for an electrical circuit on the substrate. |
申请公布号 |
AU513792(B2) |
申请公布日期 |
1981.01.08 |
申请号 |
AU19780035568 |
申请日期 |
1978.04.28 |
申请人 |
PHILIPS GLOEILAPENFABRIEKEN N.V. |
发明人 |
W.C. HILDERING |
分类号 |
H05K3/34;H01L21/48;H01L21/60;H05K1/09;H05K1/18;H05K3/30;(IPC1-7):01L21/58;01L23/48;01L23/12;01L49/02 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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