BUMP FORMATION AND CONDUCTOR PASTE FOR BUMP FORMATION,申请号JP19890192612-传众专利搜索

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发明名称	BUMP FORMATION AND CONDUCTOR PASTE FOR BUMP FORMATION
摘要
申请公布号	JPH0358427(A)	申请公布日期	1991.03.13
申请号	JP19890192612	申请日期	1989.07.27
申请人	OKI ELECTRIC IND CO LTD	发明人	OKUAKI YUTAKA
分类号	H01L21/60;H05K1/09;H05K3/34;H05K3/40	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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