发明名称 A method and apparatus for orienting a wafer in a desired position at a work station.
摘要 The invention relates to an apparatus and method for orienting a substantially flat wafer. The wafer preferably has two flat registration edges of unequal length. The apparatus includes a support table (13) having a flat surface (14) for supporting the wafer, a plurality of air jets (29, 30, 31) and registration blocks (17 and 18) extending upwardly from said flat surface (14) and having registration surfaces (19, 22). Upon contact of any edge portion of the wafer with a sense means (20) projecting forwardly from one registration surface (19), air jets (29, 31) are activated to rapidly rotate the wafer in one direction until the longer of its two registration edges contacts a sense means (23) projecting forwardly from the other registration surface (22). Then air jets (30) are activated to slowly rotate the wafer in the opposite direction until said longer registration edge contacts another sense means associated with said other registration surface (22) to effect precise registration of the wafer without overshoot as all three sense means (20, 23, 24) are concurrently contacted and activated. Wafer movement by the jets thereupon terminates and vacuum is applied continuously to hold the wafer in place while the work operation is performed thereon. Since the wafer is registered solely by contact with the various sense means, contamination of the wafer by physical contacts is minimized.
申请公布号 EP0020982(A2) 申请公布日期 1981.01.07
申请号 EP19800102578 申请日期 1980.05.09
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 SANTINI, HUGO ALBERTO EMILIO;WICK, DAVID PAUL
分类号 B65G51/03;B65G49/07;G03F9/00;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65G51/03
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