Multi-chip modules capable of being air cooled.

摘要

To provide a simpler sealed multi-chip module capable of being cooled by external forced air flow, an internal piston (26) and cylinder (24) heat transfer mechanism is provided for a plurality of chips (12) and a finned external heat transfer mechanism (14) is coupled thereto. Contact between the piston and the chips served thereby is via a resilient flange (32) biassed towards the chips and extending the contact area of the piston, the flange being slotted to define fingers which may be curled to bear on the module enclosure and provide at least part of the biassing. The fins may be integral with that part of the cylinder extending proud of the remainder of the housing or may be integral with a sleeve fitting thereover. Plural pair heat transfer mechanisms may be provided, each serving a different group of chips of the module.